Semi Automatic Die Cutting Machine

Semi Automatic Die Cutting Machine

This semi automatic die cutting machine is special equipment for packing products such as cartons and paper boxes. Gripper bars with high intensity are applicable to all kinds of cardboard, paperboard and corrugated paper. This semi automatic die cutting machine with manual feeding, and automatic die cutting stripping.

Product Details

  

 Features:

1. The Semi Automatic Die Cutting Machine is equipped with front conveyor delivery mechanism.

2. The two groups of pressing wheels and two times positioning function will make the products more flat, and improve the accuracy and speed.

3. The machine’s development is combined with advantages of similar products in domestic and overseas, is special equipment for packing products such as cartons and paper boxes.

4. Gripper bars with high intensity are applicable to all kinds of cardboard, paperboard and corrugated paper. Frontal,back and side registration mechanism ensures great precision of die cutting.

5. Other parts are adopted such as intermittent mechanism with high precision, pneumatic clutch and pneumatic closed up mechanism, programmable controller and man-machine interface.

6. The interface can display various digital information of machine such as working speed, amount of paper processed,

total running time, etc. It is easy to eliminate troubles according to the display of trouble shooting.

7. Transducer is adopted to control the main motor in achieving step-less speed variation.


Technical Specifications:

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The domestic corrugated box die-cutting technology is widely used, mainly including lithographic die-cutting and circular die-cutting. Among them, die-cutting includes three methods: flat flattening, round flattening and circular die-cutting.


A cylindrical pressure roller is used instead of the pressure plate. Generally, the pressure cutting roller is on the upper side, the die cutting plate is on the bottom, and the die cutting is processed in a "line contact" manner, so that the pressure applied by the machine during molding is small and evenly distributed. Therefore, the load of the machine is relatively stable, and the die cutting of a larger format can be performed. This method is suitable for die cutting of products with different material thicknesses. However, generally the circular flat die cutting is a stop rotation or a revolution, and the two rotations are a work cycle, so the efficiency is low, and currently used less.


The circular die-type die-cutting machine has entered China for more than 20 years, and its molding drum rotates continuously, so its production efficiency is the highest among all kinds of molding machines. The product has high die-cutting precision and can be controlled at ±1 mm, and has equipment. The operation is simple, safe and reliable, and the equipment is used for a long time. In the current die-cutting equipment for post-press processing of corrugated boxes, round die-cutting has become the mainstream.


Due to its high refractive index and relative robustness, TiO2 is suitable for use in the visible and near-infrared regions, but it is difficult to obtain a stable result. TiO2, Ti2O3. TiO, Ti, these raw materials The simulated ratios of oxygen-titanium atoms were: 2.0, 1.67, 1.5, 1.0, 0. The material with a ratio of 1.67 was found to be relatively stable and produced a robust film with a repeatability of 2.21 at approximately 550 nm at a ratio of 2 The first layer of material produces a refractive index of approximately 2.06, and the refractive index of the latter layer is close to 2.21. A material with a ratio of 1.0 requires seven layers to reduce the refractive index of 2.38 to 2.21. These films are non-absorbent. Almost every TiO2 evaporation follows a principle: negligible absorption in the available spectral region, which reduces the oxygen pressure limitation and temperature and evaporation rate limitations. TiO2 requires IAD assist plating and the oxygen input port is Below the bezel.

Ti3O5 is more expensive than other types of oxides, but many people think that the risk of this material instability is smaller, PULKER et al. pointed out that the final refractive index and non-absorbability change with oxygen pressure and evaporation temperature. When the substrate temperature is high, a high refractive index is obtained. For example, when the substrate plate temperature is 400 ° C, the refractive index obtained at a wavelength of 550 nm is 2.63, but for other reasons, high temperature evaporation is generally undesired, and ion assist plating It has become a commonly used method to obtain relatively high refraction at low temperatures or even at room temperature. It is usually necessary to provide sufficient oxygen to avoid (because of absorption reduce the transmittance), but it may also need to reduce absorption and increase Laser damage threshold (LDT). The refractive index of TiO2 has a great relationship with vacuum and evaporation rate, but it can be solved by full pre-melting and IAD assist plating. Therefore, in visible and near-infrared spectroscopy, TiO2 is very It is popular with people. In the IAD assisted TiO2 plating, 200 EV is required for the evaporation using a shielded grid source, and is required for evaporation with an unshielded gate source. 333EV or less, where the average energy estimate is about 60% of the drive voltage. If the ion energy exceeds the above value, TiO2 will absorb. While SiO2 has electron gun evaporation, it can provide 600EV collision (ionizing radiation) energy without any adverse effects. The TiO2/SiO2 process uses a driving voltage of 300 EV in order to use a gateless ion source in both materials, so as to avoid changing the driving voltage for each layer. The choice of driving voltage depends on the range allowed by TiO2. , and the speed of evaporation depends on the range of full density and no absorption film. TiO2 is used for anti-reflection film, spectroscopic film, cold film, filter, high-reflection film, spectacle film, heat mirror, etc., black particles Shape and white flake, melting point: 1175 ° C


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